SURCAM® C-TYPE tissue level DENTAL IMPLANT

Simplified Soft Tissue Management

The C-Type Tissue Level Advantage

Clean Emergence Profile. Simplified Workflow.

The Surcam® C-Type Tissue Level Implant is engineered to position the restorative interface at the soft tissue level, reducing subgingival manipulation and simplifying prosthetic procedures.

Its 2.0 mm PVD-coated neck promotes healthy soft tissue integration while minimizing bacterial accumulation around the implant collar. Combined with a stable macro-design and SLA surface treatment, the system provides reliable primary stability and predictable long-term outcomes.

The tissue-level concept also enables one-stage surgery protocols, reducing surgical steps and patient discomfort.

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C-TYPE Dental Implant

Key Features & Clinical Benefits

1

Internal Hexagon – 2.42 mm

Precision internal connection ensures secure prosthetic seating and long-term mechanical reliability.

2

2.0 mm Tissue Level Neck with TiN Coating

Gold-colored TiN-coated collar supports soft tissue integration and improves hygiene by positioning the restorative margin above bone level.

3

Parallel Thread Design

Cylindrical body enhances control during insertion, particularly effective in dense bone.

4

SLA Surface Treatment

Micro-roughened surface enhances osseointegration and long-term implant success.

5

Dual Multi-Thread Geometry

Creates micro-spaces that support blood flow and improve biological response.

6

Anchoring Apex

Facilitates guided insertion and improved apical fixation.

Catalogs and resources

C-TYPE Tissue Level Implant Catalog

Comprehensive guide detailing C-Type Tissue Level implant geometry, tissue-level neck design with TiN coating, and 2.43 mm internal hex connection specifications. Covers soft tissue management concept, clinical indications, full size chart (Ø3.3–Ø4.2 mm, 8–16 mm), and diameter-specific drilling protocols

PRO GRIP Implant System Catalog

Full system overview covering Surcam’s Internal Hex platform - including implants, abutments, multi-units, Ti-bases, transfers, analogs, surgical kits, and drilling protocols.